| Customization: | Available |
|---|---|
| CAS No.: | Refer MSDS |
| Bonding Function: | Moisture Cured Adhesive |
|
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Areas of Application
Suitable for bonding of parquet flooring,laminate flooring and solid wood flooring with concrete.
Suitable for bonding with facing board and cardboard in room.
Product Features
No formaldehyde, dissociate TDI and solvent,no volatile hazardous materials during the process of curing.
No damage to the floor.
One-component,excellent extrusion,no sag, easy to application.
Good elasticity and sound insulation.
Technical Data
|
Testing Items(2) |
Performance |
|
Appearance |
Reddish Brown Paste |
|
Sagging properties(mm) |
0 |
|
Shore A-hardness(A°) |
25 approx. |
|
Tensile strength( Mpa) |
≥1.0 |
|
Elongation at break (%) |
≥400 |
|
Touch Dry time (h) |
1~3 |
|
Extrudability (g/min) |
≥100 |
|
Pollution properties |
Non |
|
Application temperature (ºC) |
-40~+90 |
|
Shelf life(month) (3) |
≥9 |
2.Value of tack free time would be affected by change of environmental temperature and humidity.
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